ESP32

ESP32 is a series of low cost, low power system on a chip microcontrollers with integrated Wi-Fi & dual-mode Bluetooth. The ESP32 series employs a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations. ESP32 is created and developed by Espressif Systems, a Shanghai-based Chinese company, and is manufactured by TSMC using their 40 nm process.It is a successor to the ESP8266 microcontroller.

Features

Features of the ESP32 include the following:

• Processors:
  • CPU: Xtensa dual-core (or single-core) 32-bit LX6 microprocessor, operating at 160 or 240 MHz and performing at up to 600 DMIPS
  • Ultra low power (ULP) co-processor
• Memory: 520 KiB SRAM
• Wireless connectivity:
  • Wi-Fi: 802.11 b/g/n/e/i
  • Bluetooth: v4.2 BR/EDR and BLE
• Peripheral interfaces:
  • 12-bit SAR ADC up to 18 channels
  • 2 × 8-bit DACs
  • 10 × touch sensors
  • Temperature sensor
  • 4 × SPI
  • 2 × I²S
  • 2 × I²C
  • 3 × UART
  • SD/SDIO/MMC host
  • Slave (SDIO/SPI)
  • Ethernet MAC interface with dedicated DMA and IEEE 1588 Precision Time Protocol support
  • CAN bus 2.0
  • IR (TX/RX)
  • Motor PWM
  • LED PWM up to 16 channels
  • Hall effect sensor
  • Ultra low power analog pre-amplifier
• Security:
  • IEEE 802.11 standard security features all supported, including WFA, WPA/WPA2 and WAPI
  • Secure boot
  • Flash encryption
  • 1024-bit OTP, up to 768-bit for customers
  • Cryptographic hardware acceleration: AES, SHA-2, RSA, elliptic curve cryptography (ECC), random number generator (RNG)
• Power Management
  • Internal LDO
  • Individual power domain for RTC
  • 5uA deep sleep current
  • Wake up from GPIO interrupt, timer, ADC measurements, capacitive touch sensor interrupt

QFN packaged chip & module

ESP32 is housed in Quad-Flat No-leads (QFN) packages of varying sizes with 49 pads. Specifically, 48 connection pads along the sides and one large thermal pad (connected to ground) on the bottom.